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Tuesday, August 30th, 2016

    Time Event
    6:00a
    Samsung Announces Exynos 7570 14nm Budget SoC

    Today Samsung LSI launches a new 14nm SoC oriented at the budget and IoT segments. The new Exynos 7570 seems to be a a successor to the Exynos 3470 and Exynos 3475 found in a few of Samsung's budget lineups such as the Galaxy S5 Mini. The chip is a quad-core A53 setup which is said to improve performance by 70% and power efficiency by 30% over its predecessor, although exact clocks weren't publicized. Equally not specified was the GPU, although because of the advertised maximum 1280x800 resolution capabilities of the display pipeline, I wouldn't expect anything more than a very small implementation of a low-end Mali series.

    The more interesting aspects of this new SoC is its connectivity features as not only does it feature an integrated UE Category 4 modem with 2x carrier aggregation capabilities, but it also as far as I know for the first time for S.LSI integrates WiFi, Bluetooth, FM and GNSS capabilities, features that have traditionally been left in the charge of dedicated solutions such as Broadcom WiFi SoCs (Which following the acquisition by Avago have exited that business segment).

    SoC Exynos 7570 Exynos 7580 Exynos 7870
    CPU 4x A53 @ ?GHz 8x A53 @ 1.6GHz 8x A53 @ 1.6GHz
    GPU ? Mali T720MP3
    @ 600MHz
    Mali T830MP2
    @ 700MHz
    Encode/
    Decode
    1080p60
    H.264 
    Camera/ISP Dual ISP
    21MP / (13+8)
    Dual ISP
    16MP / (8+8)
    Dual ISP
    16MP / (8+8)
    Integrated
    Modem
    Cat. 4
    150Mbps DL 

    2x20MHz C.A.
    Cat. 6
    300Mbps DL 

    2x20MHz C.A.
    Cat. 6
    300Mbps DL 

    2x20MHz C.A.
    Connectivity WiFi, BT, FM,
    GNSS
    N/A
    Mfc. Process 14nm 28nm HKMG 14nm

    Earlier this year we were surprised to see Samsung announce a 14nm mid-range product as we weren't expecting the economics of the new FinFET manufacturing processes to work out for anything other than flagships SoCs, but soon after Qualcomm followed suit with their own 14nm mid-range SoC. Today's announcement seems to further dispell the doom & gloom over FinFET manufacturing cost as the Exynos 7570's stictly low-end and IoT orientation makes it the first budget SoC on the new process and something as I see as a positive development as the industry continues to shift to full FinFET lineups.

    7:00a
    The AnandTech Podcast, Episode 37: IDF 2016, Alloy, Joule, Broxton, and AMD Zen

    Today’s podcast covers the show known as the Intel Developer Forum, or IDF for short. IDF is an annual event focusing on new Intel technologies and product visions, showcasing what is new from small maker-like ‘Internet of Things’ devices all the way up to server platforms and everything in-between. Ian and Ryan were at the show, with plenty of meetings on tap. We found some time to put our thoughts on the announcements in a microphone.

    The AnandTech Podcast #37: IDF 2016

    The AnandTech Podcast - Episode 37
    Featuring

    iTunes
    RSS - mp3m4a
    Direct Links - mp3m4a

    Total Time:  47 minutes 57 seconds

    Outline mm:ss

    00:00 - Start
    01:20 - Intel IDF Keynote
    01:40 - Project Alloy, Untethered VR
    08:13 - Intel Joule IoT Platform
    15:35 - Intel Broxton SoC
    20:50 - Knights Landing
    22:15 - Knights Mill
    25:20 - AMD Zen
    37:40 - AMD Naples
    47:57 - FIN

    Related Reading

    IDF 2016 Keynote Live Blog
    Intel Announces Project Alloy: Untethered Augmented Reality in a VR Headset
    Intel Unveils Joule: A High-Performance Atom-Powered IOT Module and Maker Kit
    More Details on Broxton: Quad Core, ECC, Up to 18 EUs of Gen 9
    Intel Announces Knights Mill: A Xeon Phi for Deep Learning

    AMD Zen Microarchitecture Part 1: Micro-op Cache, Schedulers and Memory Hierarchy
    AMD Zen Microarchitecture Part 2: Extracting ILP, More Juicy Details
    AMD Zen Server CPU and Motherboard Breakdown: 2P for Q2 2017
    Unpacking AMD's Zen Benchmark: Is Zen actually 2% Faster than Broadwell?

    9:00a
    Intel Announces 7th Gen Kaby Lake: 14nm PLUS, Six Notebook SKUs, Desktop coming in January

    When Intel first announced the shift from the dual-stage ‘Tick-Tock’ methodology that had driven their core CPU design teams for over a decade into the three-way ‘Process, Architecture, Optimization’ paradigm, there were questions as to how much of the final stage, the Optimization, would actually change the way CPUs were presented or offer upgrades in performance. At the time, ‘Kaby Lake’ as the name for Intel’s third crack at their 14nm process was well known, but users wondered if it was just another Devil’s Canyon (better overclocking) or a full on CPU launch. Well the answer is the latter, and the launch is staggered between today and January. Roll on Kaby Lake. Is that Kah-bee Lake, or Kay-bee Lake?

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