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Wednesday, March 17th, 2021

    Time Event
    8:00a
    AMD Set To Roll Out AGESA firmware USB Fix For Ryzen, Coming April

    Last month, we reported that AMD had been made aware of many users experiencing intermittent connectivity issues with USB ports on its Ryzen 500-series motherboards. Requesting that users with any USB drop-out issues reach out directly to them, AMD has now released a statement confirming that it's planning to release a firmware update via a new AGESA update.

    A post on Reddit by the official AMD account, u/AMD, has revealed that AMD will distribute a new firmware update named AGESA 1.2.0.2 to its motherboard partners within a week. AGESA (AMD's Generic Encapsulated System Architecture) is AMD's primary base on which motherboard vendors build their firmware around. This means it's likely that an update alleviating users with problematic and intermittent USB issues isn't far away.

    AMD's official statement on its new updated AGESA reads as follows:

    We would like to thank the community here on r/AMD for its assistance with logs and reports as we investigated the intermittent USB connectivity you highlighted. With your help, we believe we have isolated the root cause and developed a solution that addresses a range of reported symptoms, including (but not limited to): USB port dropout, USB 2.0 audio crackling (e.g. DAC/AMP combos), and USB/PCIe Gen 4 exclusion.

    AMD has prepared AGESA 1.2.0.2 to deploy this update, and we plan to distribute 1.2.0.2 to our motherboard partners for integration in about a week. Customers can expect downloadable BIOSes containing AGESA 1.2.0.2 to begin with beta updates in early April. The exact update schedule for your system will depend on the test and implementation schedule for your vendor and specific motherboard model. If you continue to experience intermittent USB connectivity issues after updating your system to AGESA 1.2.0.2, we encourage you to download the standalone AMD Bug Report Tool and open a ticket with AMD Customer Support.

    Randomized USB disconnects can present many issues for a variety of users, with reports of USB capture devices cutting out while recording and problems with VR headsets that primarily rely on its power from USB ports. This also stretches to mouse and keyboard input issues which can also cause an inconvenience to end-users. 

    Despite AMD admitting that there is an underlying issue surrounding USB ports on its Ryzen 5000 and Ryzen 3000 processors when used with 500 and 400-series motherboards, it hasn't gone into details about the fix. They believe they have identified the root cause of the issues, and the new AGESA 1.2.0.2 firmware should begin rolling out sometime in April.

    Source: r/AMD

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    10:00a
    Noctua Announces First Cooler in Redux Series, NH-U12S Redux

    One of the most popular air cooling brands, Noctua, has announced the first CPU cooler in its highly anticipated Redux series, the NH-U12S Redux. The Redux series is designed to offer a streamlined and more affordable entry point to some of Noctua's most popular (and sometimes expensive) CPU coolers. Noctua also launches its NA-FK1 Redux second cooling fan kit as an optional extra.

    Focusing on the new NH-U12S Redux, Noctua has 'streamlined' its previous NH-U12S cooler by opting for a four heat pipe design instead of five on the previous version. Another difference is that Noctua has opted out of a soldered interface between the heat pipes and the cooling fins and supplies just one NF-P12 Redux 120 mm cooling fan to reduce overall costs.

    Noctua also has one of the simplest and most popular mounting kits in recent times, with its SecuFirm2 mounting system, with support for LGA11xx, LGA15xx, LGA20xx, as well as Intel's latest LGA1200 socket. The SecuFirm2 mounting kit also supports AMD's AM4 socket. The new Redux series has also stripped away some of the unnecessary fluff to allow a lower entry-point for users on a budget but still looking for similar quality and performance levels.

    In addition to the NH-U12S Redux, Noctua has made an optional 120 mm fan kit for systems that demand more cooling performance, the NA-FK1 Redux. The NA-FK1 kit includes one matching NF-P12 Redux 1700 rpm cooling fan, with four grey anti-vibration pads, a pair of fan mounting clips, a 4-pin PWM Y-cable, and two NA-RC14 low-noise adaptors. Where the original NH-U12S comes supplied with both cooling fans, the Redux series gives users the option to purchase this separately, which lowers the cooler's overall cost.

    To increase its products' longevity, Noctua includes its NH-U12S Redux in its future mounting upgrade scheme, which allows users to request a new mounting kit if a new socket is announced cooler can officially support. Noctua is a little vague in specifying if this service is free of charge and states that as long as it's technically possible for them to do so, it could make the NH-U12S Redux a good long-term investment for a current build and future upgrade paths.

    Amazon (US) Link

    Noctua also includes a 6-year limited warranty with the NH-U12S Redux and has set an MSRP of $50 and €50, with stock available at its official Amazon store from today. The additional NA-FK1 Redux 120 mm fan kit is also available today and has an MSRP of $17/€17.

    Source: Noctua

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    7:15p
    Intel CEO Pat Gelsinger To Host Webcast About Intel’s Future On March 23rd

    Intel today has announced that the company will be holding an event on March 23rd to discuss the future of engineering at the company. Dubbed “Intel Unleashed: Engineering the Future”, the hour-long webcast will be hosted by recently hired CEO (and Intel returnee) Pat Gelsinger.

    Join Intel CEO Pat Gelsinger for a business update and webcast address on the new era of innovation and technology leadership at Intel.

    While Intel’s official description is short and at a high level, given the subject matter and the fact that the presentation is scheduled for after the stock markets close, we’re expecting that this will be Intel’s much-awaited announcement on the future of the company’s manufacturing plans. For the last several months the company has been juggling the question of when and where to use third-party foundries versus investing in their own manufacturing technologies. Intel’s 7nm problems have become a black eye for the company, and the prolific processor producer has been under pressure from some investors to cut back on expensive R&D and just use pure-play foundries like TSMC.

    Prior to Intel hiring Gelsinger to be their new CEO in mid-January, the company had been preparing to detail its future foundry plans in its January 21st earnings call. However after bringing Gelsinger on board, that announcement was put on hold to give Gelsinger a time to get up to speed, and possibly make his own mark if he decided to take the company in a different direction than then-CEO BoB Swan was preparing to go.

    If this does turn out to be a detailed disclosure of Intel’s foundry plans, then it’s not an exaggeration to say that this webcast will be one of the most critical Intel presentations in years. Gelsinger and the rest of Intel’s upper management have some very difficult choices to make about manufacturing, and no matter what direction they opt to take on Tuesday, it’s going to have significant ramifications for not only Intel, but the rest of the silicon foundry industry as a whole. So tech enthusiasts and investors alike are going to be paying close attention to this announcement.

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