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Tuesday, June 8th, 2021
| Time | Event |
| 8:00a | Computex 2021: G.Skill Trident Z Royal Elite With DDR4-4000 CL14, Tight Latencies
During Computex 2021, G.Skill has announced a couple of new memory kits featuring its regal-looking Trident Z Royal Elite heatsinks. Available with super tight primary latencies of CL14, the new Trident Z Royal Elite kits will be available in DDR4-4000 and DDR4-3600, with various capacities available, including 16, 32, 64, and 128 GB kits. There are many different parts of a system that can add varying levels of aesthetic glamor, including the motherboard, CPU cooler, fans, anything with RGB on it, but almost everything struggles to be as bling as G.Skills Trident Z Royal Elite memory. Launched back in April, the G.Skill Trident Z Royal Elite comes available in gold and silver. Both color variants feature eight customizable RGB LED lighting zones, with a patented crystalline patterning across for that regal touch.
Touching on the specifications, the top kit features speeds of DDR4-4000 with CL14-14-14-35, at a larger-than-expected operating voltage of 1.55 V. It will be available in two varieties, including a 16 GB (2 x 8 GB), and a 32 GB (2 x 16 GB) kit. The DDR4-3600 kits come with equally tight CL14 latencies, with a slightly lower 1.45 V operating voltage, and will be available in 16 GB (2 x 8 GB), 32 GB with the option for 2 x 16 GB or 4 x 8 GB kits. For users looking for more capacity, there are options at 64 GB with 4 x 16 GB and a large 128 GB kit with 8 x 16 GB. G.Skill says the new Trident Z Royal Elite DDR4-4000 and DDR4-3600 CL14 kits will be available from June but haven't provided us with pricing at the time of writing. Gallery: Computex 2021: G.Skill
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| 12:15p | An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers. In this event, TSMC discussed its increasing use of Extreme Ultra Violet (EUV) lithography for manufacturing, enabling it to scale down to its 3nm process node, well beyond that of its competitors. TSMC also addressed the current issues surrounding demand for semiconductors, along with announcing that it is building new facilities for advanced packaging production. Joining CEO Dr. CC Wei as part of the keynote presentation was AMD’s CEO Dr. Lisa Su, Qualcomm’s President (and soon to be CEO) Cristiano Amon, and Ambiq’s Founder and CTO Scott Hanson. As part of the proceedings, TSMC offered AnandTech a 30-minute interview with Dr. Kevin Zhang, SVP of Business Development, and Dr. Maria Marced, President of TSMC EU, as an opportunity to learn more about TSMC’s driving directions as well as cooperation with industry partners. |
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