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Monday, November 22nd, 2021
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12:12a |
Intel's Expensive New Plan to Upgrade Its Chip Technology - and US Manufacturing America's push to manufacturer more products domestically gets an in-depth look from CNET — including a new Intel chip factory outside of Phoenix.
CNET calls it a fork in the road "after squandering its lead because of a half decade of problems modernizing its manufacturing..."
With "a decade of bad decisions, this doesn't get fixed overnight," says Pat Gelsinger, Intel's new chief executive, in an interview. "But the bottom is behind us and the slope is starting to feel increasingly strong...." More fabs are on the way, too. In an enormous empty patch of dirt at its existing Arizona site, Intel has just begun building fabs 52 and 62 at a total cost of $20 billion, set to make Intel's most advanced chips, starting in 2024. Later this year, it hopes to announce the U.S. location for its third major manufacturing complex, a 1,000-acre site costing about $100 billion. The spending commitment makes this year's $3.5 billion upgrade to its New Mexico fab look cheap. The goal is to restore the U.S. share of chip manufacturing, which has slid from 37% in 1990 to 12% today. "Over the decade in front of us, we should be striving to bring the U.S. to 30% of worldwide semiconductor manufacturing," Gelsinger says...
But returning Intel to its glory days — and anchoring a resurgent U.S. electronics business in the process — is much easier said than done. Making chips profitably means running fabs at maximum capacity to pay off the gargantuan investments required to stay at the leading edge. A company that can't keep pace gets squeezed out, like IBM in 2014 or Global Foundries in 2018. To catch up after its delays, Intel now plans to upgrade its manufacturing five times in the next four years, a breakneck pace by industry standards. "This new roadmap that they announced is really aggressive," says Linley Group analyst Linley Gwennap. "I don't have any idea how they are going to accomplish all of that...."
Gelsinger has a tech-first recovery plan. He's pledged to accelerate manufacturing upgrades to match the technology of TSMC and Samsung by 2024 and surpass them in 2025. He's opening Intel's fabs to other companies that need chips built through its new Intel Foundry Services (IFS). And he's relying on other foundries, including TSMC, for about a quarter of Intel's near-term chipmaking needs to keep its chips more competitive during the upgrades. This three-pronged strategy is called IDM (integrated design and manufacturing) 2.0. That's a new take on Intel's philosophy of both designing and making chips. It's more ambitious than the future some had expected, in which Intel would sell its factories and join the ranks of "fabless" chip designers like Nvidia, AMD and Qualcomm that rely on others for manufacturing...
Shareholders may not like Gelsinger's spending-heavy strategy, but one community really does: Intel's engineers... Gelsigner told the board that Intel is done with stock buybacks, a financial move in which a company uses its cash to buy stock and thereby increase its price. "We're investing in factories," he told me. "That's going to be the use of our cash...."
"We cannot recall the last time Intel put so many stakes in the ground," said BMO Capital Markets analyst Ambrish Srivastava in a July research report after Intel announced its schedule.
Intel will even outpace Moore's law, Gelsinger tells CNET — more than doubling the transistor count on processors every two years. "I believe that you're going to see from 2025 to 2035 a very healthy period for Moore's Law-like behavior."
Although that still brings some risk to Intel's investments if they have to pass the costs on to customer, a Linley Group analyst points out to CNET. "Moore's Law is not going to end when we can't build smaller transistors. It's going to end when somebody says I don't want to pay for smaller transistors."
Read more of this story at Slashdot. | 8:07p |
Qualcomm is Updating Its Snapdragon Branding To Try and Simplify Its Chip Names Qualcomm has announced some key changes to how it brands its Snapdragon chips, including a shift away from the three-digit numbering system it's been using to differentiate between its products for years. From a report: To start, Snapdragon will now exist as a standalone brand, separate from the "Qualcomm" brand (which won't be showing up as much on its chips). It's a direction the company has started moving in earlier this year (the Snapdragon 888 Plus badge, for example, notably lacked the word "Qualcomm"), but today's news solidifies that plan going forward. But the biggest change might be in how the company handles actually naming its semiconductor products.
For years, Qualcomm has labeled its chips with three-digit names, like the Snapdragon 480, Snapdragon 765, or Snapdragon 888. The first number broadly informed customers how powerful the chip was (with the 8-series chips serving as flagships, while 4-series models were for entry-level products). The second number typically indicated annual generational releases (going from a Snapdragon 865 to an 875), while changes in the third number generally showed more minor updates (like the Snapdragon 765G to the Snapdragon 768G). The problem, though, is that in addition to being slightly jargony and confusing to keep track of, Qualcomm is also simply running out of numbers in its naming scheme. The 8-series lineup hit Snapdragon 888 last year, the 7-series is already at Snapdragon 780, and the 6-series is already on the brink with the Snapdragon 695. Going forward, though, Qualcomm says that it'll be shifting to "a single-digit series and generation number, aligning with other product categories," starting with the upcoming announcement of its next 8-series flagship (which had previously been expected to be called the Snapdragon 898, based on Qualcomm's old pattern).
Read more of this story at Slashdot. |
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