Slashdot: Hardware's Journal

New Thermal Material Provides 72% Better Cooling Than Conventional Paste
"Researchers at the University of Texas have unveiled a new thermal interface material that could revolutionize cooling, outperforming top liquid metal solutions by up to 72% in heat dissipation," writes Slashdot reader jjslash. "This breakthrough not only improves energy efficiency but also enables higher-density data center setups, cutting cooling costs and energy usage significantly." TechSpot reports: Thanks to a mechanochemically engineered combination of the liquid metal alloy Galinstan and ceramic aluminum nitride, this thermal interface material, or TIM, outperformed the best commercial liquid metal cooling products by a staggering 56-72% in lab tests. It allowed dissipation of up to 2,760 watts of heat from just a 16 square centimeter area. The material pulls this off by bridging the gap between the theoretical heat transfer limits of these materials and what's achieved in real products. Through mechanochemistry, the liquid metal and ceramic ingredients are mixed in an extremely controlled way, creating gradient interfaces that heat can flow across much more easily. Beyond just being better at cooling, the researchers claim that the higher performance reduces the energy needed to run cooling pumps and fans by up to 65%. It also unlocks the ability to cram more heat-generating processors into the same space without overheating issues. [...] As for how you can get your hands on the material: it's yet to make it out of the labs. The UT team has so far only tested it successfully at small scales but is now working on producing larger batches to put through real-world trials with data center partners. The material has been detailed in a paper published in the journal Nature Nanotechnology.