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Пишет AnandTech (![[info]](http://lj.rossia.org/img/syndicated.gif){kind=small} syn_anandtech)@ 2019-08-20 19:10:00 |
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Hot Chips 31 Live Blogs: Intel Lakefield and Foveros
One of the interesting developments in packaging technology in recent memory is the 3D stacking of Intel's new Foveros technology. The first chip to use this packaging technology is called Foveros, and today we have a talk on the chip.
