Intel Details Comeback Plan To Leapfrog Chipmaking Rivals by 2025
Intel unveiled on Tuesday a smorgasbord of new technologies designed to help it reclaim processor manufacturing leadership within four years. The plans bear the fingerprints of newly installed CEO Pat Gelsinger, who has pledged to restore the company's engineering leadership and credibility. From a report: The developments include a new push to improve the power usage of Intel chips, a key element of battery life, while simultaneously raising chip performance. The technologies involve deep redesigns to how processors are constructed. One technology, RibbonFET, fundamentally redesigns the transistor circuitry at the heart of all processors. Another, PowerVia, reimagines how electrical power is delivered to those transistors. Lastly, Intel is updating its Foveros technology for packaging chip elements from different sources into dense stacks of computing horsepower. Intel's commitments, unveiled at an online press event, will mean faster laptops with longer battery life, if realized. And the advancements could boost technologies like artificial intelligence at cloud computing companies and speed up the services on mobile phone networks. "In 2025, we think we will regain that performance crown," Sanjay Natarajan, who rejoined Intel this year to lead the company's processor technology development, said in an interview. Further reading: Intel's foundry roadmap lays out the post-nanometer "Angstrom" era.

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